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RT917407 VN1010 100336 NMF0513D 2A102 D4C0212N LBN70A52 STP20N
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  multilayer ceramic chip capacitors 1 of 3 creation date : november 28, 2017 (gmt) C1608X7R1A225M080AE tdk item description c1608x7r1a225mt***s applications commercial grade feature soft soft termination series c1608 [eia 0603] status production size length(l) 1.60mm +0.20,-0.10mm width(w) 0.80mm +0.15,-0.10mm thickness(t) 0.80mm +0.15,-0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 2.2f 20% rated voltage 10vdc temperature characteristic x7r(15%) dissipation factor (max.) 10% insulation resistance (min.) 45m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 28, 2017 (gmt) C1608X7R1A225M080AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance C1608X7R1A225M080AE esr C1608X7R1A225M080AE capacitance C1608X7R1A225M080AE dc bias characteristic C1608X7R1A225M080AE temperature characteristic C1608X7R1A225M080AE(no bias) C1608X7R1A225M080AE(dc bias = 5v) ripple temperature rising C1608X7R1A225M080AE(100khz) C1608X7R1A225M080AE(500khz) C1608X7R1A225M080AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 28, 2017 (gmt) C1608X7R1A225M080AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.


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